BIDI SFP 1.25G 1310/1550NM DDM 40KM
SOPTIC’s SFP-BD40-SC15 Small Form Factor Puggable (SFP) transceivers are compatible with the Small Form Factor Pluggable Multi-Sourcing Agreement (MSA), The transceiver consists of five sections: the LD driver, the limiting amplifier, the digital diagnostic monitor, the DFB laser and the PIN photo-detector. The module data link up to 40km in 9/125um single mode fiber.
The optical output can be disabled by a TTL logic high-level input of Tx Disable, and the system also can disable the module via I2C. Tx Fault is provided to indicate that degradation of the laser. Loss of signal (LOS) output is provided to indicate the loss of an input optical signal of receiver or the link status with partner. The system can also get the LOS (or Link)/Disable/Fault information via I2C register access.
Up to 1.25Gb/s data links
DFB laser transmitter and PIN photo-detector
Up to 40km on 9/125μm SMF
Hot-pluggable SFP footprint
BIDI SC/UPC type pluggable optical interface
Low power dissipation
Metal enclosure, for lower EMI
RoHS compliant and lead-free
Single +3.3V power supply
Support Digital Diagnostic Monitoring interface .
Compliant with SFF-8472
Case operating temperature
Commercial: 0°C to +70°C
Extended: -10°C to +80°C
Industrial: -40°C to +85°C
Switch to Switch Interface
Switched Backplane Applications
Other Optical Links
The BIDI SFP single fiber two-way optical transceiver module produced by SOPTIC technology enjoys wide application at home and abroad due to its high quality and low cost. The products are mainly used in telecommunication, energy, transportation, railway, optoelectronics, aerospace, military, education and other fields.
SFP Optic Transceiver Compatible with CISCO, Huawei, H3C, HP... Brands like switches and routers, and more: 3Com, Alcatel-lucent, Allied Telesis, Avaya, Brocade, Blade, Bdcom, d-link, Dell, Emulex, Enterasys, Extreme, Force10, Foundry, Hirschmann, IBM, Intel, Juniper, Linksys, Marconi, McAfee, Netgear, Nortel, q-logic, Redback, SMC, SUN, TRENDnet, ZTE, ZYXEL, Ruijie, and so on .
To implement various Low Cost, Low Power and Cloud Management Optical Interconnection applications for customers by using a variety of Hybrid Packaging Technology (including VCSEL, Coherent Optics and Silicon Photonics Chips) Platforms. These applications cover the following areas we have known, that is, On-Chip Optical Interconnection, Interplate Optical Interconnection, Rack Optical Interconnection, Equipment Optical Interconnection, Consumer Multimedia Optical Interconnection and Cloud Optical Interconnection.